Firmware Version 1.7.1 (Build No. 1.7.1_20230502_210200_tw)

Release|2023-06-08

Hanwha Techwin OEM FW

Bug Fixes

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1. Only Hanwha Techwin SDK is allowed to connect. (Except BS2_GetFactoryConfig)

2. The firmware upgrade is available only with Hanwha Techwin OEM firmware.

3. Remove all relay action.

Firmware Version 1.7.1 (Build No. 1.7.1_221220)

Release|2023-01-11

注意

Devices with the new SE processor cannot downgrade to a lower version after upgrading the firmware to v1.7.1 or later. Devices with existing SE processor can be downgraded to a lower version.

For more information, check the serial number of the device and contact the Suprema.

New Features and Improvements

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1. Supports a new SE processor and new firmware.

2. Separated the log related to the cause of the door unlock.

   • Door open request by exit button

   • Door open request by operator

3. Added relay deactivation option for exit button input.

   • Added the option to set the door open request log to occur but the relay not to operate when the exit button is pressed.

Bug Fixes

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1. Card types not checked to be used in smart card settings gets issued normally 発生バージョン: 1.5.0.

2. Improved the structure to prevent authentication fail caused by broken database or cache memory 発生バージョン: 1.0.0.